VTS-CreaTec GmbH - High Quality MBE Products

RTA System

Rapid Thermal Annealing System for a wide range of applicatons

RTA system for processing semiconductor wafers by thermal annealing process in an environment from ultra-high vacuum to ambient pressure with different atmospheres like oxygen an nitrogen.

Clean, simple an rugged design for compatibility with today's semiconductor processing technologies.

Several unique features guarantee excellent uniformity and process reproducibility.

1) View into the reaction chamber
(heater not mounted)

2) Tranferring a wafer from load-lock chamber

The RTA System is used for rapid thermal annealing of wafers either in ultra-high vacuum (UHV) or other atmospheres like oxygene or nitrogen with a variable pressure. The wafer is heated by an array of high-power quartz-lamps.

The complete system consisits of two UHV chambers, the load-lock chamber and the process chamber. Both chambers are pumped by turbo-molecular pumps and are equipped with a pressure measurement system that spans the range from 1000 mbar down to 10^-9 mbar. With a magnetically coupled transfer system the wafer is transferred into the reaction chamber. Viewports allow the direct observation of the RTA process.

A gas handling system can be installed to provide an exactly defined gas pressure level in the reaction chamber. During the RTA process, this atmosphere can be analyzed with a quadrupole mass spectrometer.

To measure the wafer temperature, thermocouple and pyrometer are used. Optionally, the system can be automatically operated using our process control software EMERALT, including vacuum control and process documention.

As a second option, other instruments like a custom-designed magnet can be fitted to modify the process conditions or analyze the response of the sample wafer during the RTA process.